Ending with a teardown related chat, this installment is about the mid-architecture design used on the ROG 8 Pro. The reason why it looks so complex and has so many FPCs inside is fundamentally influenced by the mid-architecture. In common three-segment architecture phones, many components can be directly connected to the motherboard, such as the rear lens, front lens, and even some can be directly integrated on the motherboard, such as the noise-canceling microphone and ambient light sensor. But to the middle of the architecture of the phone, because the location of those parts can not be moved, and concentrated in the upper part, they and the motherboard pulled away from a long distance, the middle is also separated from a battery, these densely packed FPC, became their connection to the motherboard, the realization of their respective functions of the "pipeline" and "bridge ". Those components mentioned earlier, are through this way, directly or indirectly connected to the motherboard.
